Toyota – System Impact Assessment of new chip packaging technologies

Toyota Europe were looking to better understand the trends in chip packaging and the potential impact on the system design of cars.

The project was led by Frost & Sullivan who chose Mindsheet to undertake the assignment

System Impact Assessment of new chip packaging technologies

System Impact Assessment of new chip packaging technologies

In particular, Mindsheet’s role was:

  • Research chip packaging global IP
  • Trends in chip packaging and interconnect
  • Understand the impact on car design at the system level
Patent Analysis by Institution

Patent Analysis by Institution, Mindsheet Toyota assignment 2005

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  • The presentation was great from Mindsheet and so was the interaction with each and everyone of us. Janine Pert
  • Mindsheet were called in to supplement our knowledge of a business opportunity that we were developing. They rapidly assimilated the key strategic issues around the market and our capabilities. In a very short time they confirmed our strategy and identified practical steps for exploiting the opportunity. We were impressed at their speed, use of strategy structuring tools and market knowledge. Kim Stansfield
    Programme Manager, Northrop Grumman

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